Special Issue on The Application of Engineering in the Industry

Submission Deadline: Apr. 10, 2020

Please click the link to know more about Manuscript Preparation: http://www.iejournal.org/submission

This special issue currently is open for paper submission and guest editor application.

Please download to know all details of the Special Issue

Special Issue Flyer (PDF)
  • Lead Guest Editor
    • Hadi Erfani
      Department of Chemical Engineering, Faculty of Engineering, Payame Noor University, Alborz, Iran
  • Guest Editor
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to complete the Guest Editor application.
    • Bhushan Malkapurkar
      Department of electronic & telecommunication engineering, dr d y patil School of engineering & technology, Pune, India
    • Monika Maral
      Department of electronic & telecommunication engineering, dr d y patil School of engineering & technology, Pune, India
    • Gazala Parveen Patel
      Department of electronic & telecommunication engineering, dr d y patil School of engineering & technology, Pune, India
    • Narendra Kumar Ahirwar
      Department of biological sciences, faculty of sciences and environment, Mahatma Gandhi Chitrakoot Gramoday Vishwavidyalaya, Chitakoot, Satna (Madhya Pradesh), India
    • Priyanka Gupta
      Devi Ahilya Vishwavidyalaya, Indore, Madhya Pradesh, India
    • Sushma Singh
      Delhi Directorate of Education, New Delhi, Delhi, India
    • Behrouz Eftekhari
      Institute for color science & technology, Tehran, Iran
    • Francisco Baruck
      Department of Industrial Engineering, Instituto Tecnológico de Aguascalientes, Aguascalientes, Mexico
      Department Of Textile Engineering, Mawlana Bhashani Science and Technology University, Tangail, Bangladesh
  • Introduction

    Engineering today plays an important role in the industry and can solve problems. Individuals who are engineers can solve a lot of problems because they have a very high ability to deal and there is no unavoidable problem for them. The application of engineering in the industry means the use of professionals in the industry and the solution of problems consequently, the success of science and technology that leads to progress. The purpose of this journal is to identify specialists and researchers in the industry and to propose solutions to help us, in addition to identifying the problems and removing their defects in order to grow technology, innovations, creativity and entrepreneurship. One of the most important discussions in the industry is research and development. R & D is a must-have achievement and in large-scale achievements in many industrial research and development programs, there is a special place that can be considered as one of the engineering applications in the industry.

    Aims and Scope:

    1. Research and Development
    2. Engineering
    3. Industrial
    4. Education & innovation
    5. Application
    6. Optimization

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.iejournal.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.